CH-1705
Electroplating
Chemistry · Secondary 4 · Medium · Electroplating
During electroplating, a spoon is coated with copper using an aqueous solution of copper(II) sulfate. After some time, the mass of the spoon increases from 12.0 g to 13.1 g. What causes this increase in mass?
- Gas bubbles forming on the spoon surface
- Copper metal dissolving from the spoon
- Oxidation of copper atoms on the spoon
- Reduction of copper ions onto the spoon
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